| 摘要 |
A method of manufacturing semiconductor devices is provided, in which a resin sealing structure includes an interconnection substrate board, semiconductor chips, a heat radiation plate, and sealing resin. The method is achieved by cutting the heat radiation plate by a plate cutting blade in a first direction along a first heat radiation plate cutting line; by cutting the heat radiation plate by the plate cutting blade in a second direction along a second heat radiation plate cutting line, after cutting in the first direction by the plate cutting blade; and by cutting the interconnection substrate board and the sealing resin along first and second interconnection substrate board cutting lines by a substrate board cutting blade in the first direction and the second direction, respectively. The second heat radiation plate cutting line and the second interconnection substrate board cutting line correspond to each other in position in a third direction orthogonal to the first direction and the second direction. The first heat radiation plate cutting line is displaced from the first interconnection substrate board cutting line by a preset displacement amount in a direction opposite to the second direction.
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