发明名称 BOILING HEAT TRANSFER DEVICE
摘要 A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.
申请公布号 US2011214840(A1) 申请公布日期 2011.09.08
申请号 US200913128740 申请日期 2009.10.22
申请人 SAKAMOTO HITOSHI;YOSHIKAWA MINORU;HASHIGUCHI TAKEYA 发明人 SAKAMOTO HITOSHI;YOSHIKAWA MINORU;HASHIGUCHI TAKEYA
分类号 F28D15/02 主分类号 F28D15/02
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