发明名称 |
BOILING HEAT TRANSFER DEVICE |
摘要 |
A boiling heat transfer device of the present invention includes: a heat receiving portion that boils a liquefied refrigerant to convert it to vapor, and contacts with a device to be cooled and cools the device to be cooled; a vapor tube that connects to an upper portion of the heat receiving portion and conveys the vapor generated by the heat receiving portion; a heat dissipating portion that condenses the vapor conveyed from the vapor tube to convert it to a liquefied refrigerant and dissipates heat to an atmosphere; and a liquid tube that returns to the heat receiving portion the liquefied refrigerant condensed by the heat dissipating portion. At least a portion of a cross-sectional area of a flow passage of the vapor in the heat receiving portion gradually decreases from a lower portion of the heat receiving portion toward the upper portion of the heat receiving portion.
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申请公布号 |
US2011214840(A1) |
申请公布日期 |
2011.09.08 |
申请号 |
US200913128740 |
申请日期 |
2009.10.22 |
申请人 |
SAKAMOTO HITOSHI;YOSHIKAWA MINORU;HASHIGUCHI TAKEYA |
发明人 |
SAKAMOTO HITOSHI;YOSHIKAWA MINORU;HASHIGUCHI TAKEYA |
分类号 |
F28D15/02 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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