| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive composition by which a semiconductor device having excellent reflow-resistant properties and connection reliability can be prepared, to provide a pressure-sensitive adhesive sheet for circuit member connection and to provide a method for manufacturing a semiconductor device. <P>SOLUTION: The pressure-sensitive adhesive composition includes (A) a polymer component having a weight-average molecular weight of 100,000 or more, (B) an epoxy resin, (C) an epoxy resin curing agent, (D) a compound having a glycidyl group and an ethylenically unsaturated group and (E) a photoinitiator. The pressure-sensitive adhesive sheet 10 for circuit member connection includes a light transmissible supporting base material 3 and a pressure-sensitive adhesive layer 2 provided on the supporting base material and made of the pressure-sensitive adhesive composition. In the method for manufacturing the semiconductor device, the pressure-sensitive adhesive sheet is used. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
