发明名称 HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat treatment apparatus and a heat treatment method efficiently removing PCB (polychlorinated biphenyl) attached to a treating object. <P>SOLUTION: The heat treatment apparatus has a heat treatment furnace 20 having a heater 40 and heat-treating the treating object 18 to which polychlorinated biphenyl is attached, a front chamber 22 and a rear chamber 24 provided in a front stage and a rear stage of the heat treatment furnace respectively, and partitioned by openable/closable doors 26, 28, 30 and 32 respectively, and a negative pressure holder 38 keeping the front chamber and the rear chamber at a negative pressure. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011173075(A) 申请公布日期 2011.09.08
申请号 JP20100039769 申请日期 2010.02.25
申请人 NICHIYO ENGINEERING KK 发明人 SASAKI SHIZUO;AOYAMA HARUNORI;FUJISHIMA KATSUHIKO
分类号 B09B3/00;A62D3/40;A62D101/22;F23G7/00;F27B9/02;F27B9/30;F27D17/00 主分类号 B09B3/00
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