| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a novel semiconductor device capable of inputting signals and power without the use of an FPC (flexible printed circuit). <P>SOLUTION: The semiconductor device includes a first substrate and a second substrate. A receiver antenna is provided on a surface side of the first substrate. A transmitter antenna and an integrated circuit are provided on the second substrate. The second substrate is attached on a back side of the first substrate. The receiver antenna and the transmitter antenna overlap with each other across the first substrate. Thus, the distance between the antennas can be kept constant, and signals and power can be received with high efficiency. <P>COPYRIGHT: (C)2011,JPO&INPIT |
