| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method that improves substrate productivity without making an electronic component mounting system large in size. <P>SOLUTION: In the electronic component mounting system, two electronic component mounting machines 2 equipped with two substrate transfer conveyors 13 arranged parallel are coupled to each other in a transfer direction in which substrates 3 are transferred by the substrate transfer conveyors 13, and the substrate transfer conveyors 13 that the electronic component mounting machines 2 have are connected in the transfer direction of the substrates 3 to form two transfer lanes 20, wherein a substrate 3 is positioned by one transfer lane 20 (substrate transfer lane 20a), and a component placing tray 21 on which an electronic component 5 is mounted is positioned by the other transfer lane 20 (component transfer land 20b), and the electronic component 5 mounted on the component placing tray 21 is picked up by a mounting head 16 that the electronic component mounting machine 2 has, and mounted on the substrate 3 positioned by the substrate transfer lane 20a. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
