发明名称 SUBSTRATE MOUNTING METHOD AND SUBSTRATE TAKE-OUT METHOD
摘要 PROBLEM TO BE SOLVED: To automatically mount a substrate on a substrate conveying apparatus and to automatically take out the substrate from the substrate conveying apparatus. SOLUTION: A method for mounting a substrate 21 on a substrate conveying apparatus 13 by using a substrate handling device 10 mounted on a fore-end of a robot arm 11 includes: a step of inserting the substrate handling device 10 holding the substrate 21 in an upright condition into the substrate conveying apparatus 13; a step of advancing the substrate handling device 10 toward a substrate holding frame 27 of the substrate conveying apparatus 13; a step of inclining the substrate handling device 10; a step of unlocking a locking mechanism 17 of the substrate handling device 10; a step of pressing a part in a vicinity of a bottom part of the substrate 21 against the substrate holding frame 27; a step of lowering the substrate 21 while being pressed against the substrate holding frame 27, and transferring the load of the substrate 21 to the substrate holding frame 27; a step of erecting the substrate 21 upright, and clamping it by the substrate holding frame 27; and a step of separating the substrate handling device 10 from the substrate holding frame 27. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011173732(A) 申请公布日期 2011.09.08
申请号 JP20110097458 申请日期 2011.04.25
申请人 IHI CORP 发明人 KOMAI SHINSEI;HASEGAWA KOZO;CHISHINA HIROTSUGU
分类号 B65G49/06;B25J13/00;H01L21/677 主分类号 B65G49/06
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