发明名称 CIRCUIT SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF
摘要 A method of manufacture of a circuit system includes: providing a carrier base; forming a cavity in the carrier base; forming a bridge lead over the cavity, the bridge lead exposing the cavity; and mounting a device having an anchor interconnect, the anchor interconnect is in the cavity and conformal to the bridge lead over the cavity.
申请公布号 US2011214911(A1) 申请公布日期 2011.09.08
申请号 US20100716271 申请日期 2010.03.02
申请人 CHOW SENG GUAN;KUAN HEAP HOE;PAGAILA REZA ARGENTY 发明人 CHOW SENG GUAN;KUAN HEAP HOE;PAGAILA REZA ARGENTY
分类号 H05K1/16;H05K3/30 主分类号 H05K1/16
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