发明名称 |
CIRCUIT SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of a circuit system includes: providing a carrier base; forming a cavity in the carrier base; forming a bridge lead over the cavity, the bridge lead exposing the cavity; and mounting a device having an anchor interconnect, the anchor interconnect is in the cavity and conformal to the bridge lead over the cavity.
|
申请公布号 |
US2011214911(A1) |
申请公布日期 |
2011.09.08 |
申请号 |
US20100716271 |
申请日期 |
2010.03.02 |
申请人 |
CHOW SENG GUAN;KUAN HEAP HOE;PAGAILA REZA ARGENTY |
发明人 |
CHOW SENG GUAN;KUAN HEAP HOE;PAGAILA REZA ARGENTY |
分类号 |
H05K1/16;H05K3/30 |
主分类号 |
H05K1/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|