| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device mounting body which never produces positional shift even if heat load is applied after the semiconductor device has been mounted onto the substrate. <P>SOLUTION: Three electrodes 4a, 4b, and 4c are provided on a substrate 2, and electrodes 5a, 5b, and 5c are provided on an optical semiconductor element 3 in positions opposing to the electrodes 4a, 4b, and 4c of the substrate 2. The electrodes 4a and 4b of the silicon substrate 2 and the electrodes 5a and 5b of the optical semiconductor element 3 are joined by a stud bump 7 made of gold, and the electrode 4c of the silicon substrate 2 and the electrode 5c of the optical semiconductor element 3 are joined by solder 6. The stud bump 7 is prepared in advance in the electrodes 4a and 4b of the silicon substrate 2, and the apex of this stud bump 7 is solid-phase welded to the gold-plated electrodes 5a and 5b of the optical semiconductor element 3. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
