发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR DISASSEMBLING THE WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board for easily separating wiring from an insulating material after use, to provide a method of manufacturing the wiring board, and also to provide a method of disassembling the wiring board. <P>SOLUTION: The wiring board 1 has: the insulating material 11; wiring 13 formed on the insulating material 11; and a peel-off layer 12 including metal carbonate or metal hydrogen carbonate formed between the insulating material 11 and the wiring 13. The metal carbonate include, for example, magnesium carbonate, thallium carbonate, silver carbonate, copper carbonate, lead carbonate, zinc carbonate, iron carbonate, or cobalt carbonate. The metal hydrogen carbonate include, for example, sodium hydrogen carbonate, or potassium hydrogen carbonate. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2011176076(A) 申请公布日期 2011.09.08
申请号 JP20100038300 申请日期 2010.02.24
申请人 EMPRIE TECHNOLOGY DEVELOPMENT LLC 发明人 IWAMOTO TAKASHI
分类号 H05K3/46;B09B3/00;H05K3/34 主分类号 H05K3/46
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