| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiating substrate in which warpage is restrained and a heat radiating property is improved. SOLUTION: The heat radiating substrate includes a copper plate 41 as a circuit member on one principal face of a silicon nitride substrate 2 comprising a silicon-nitride based sintered body, and a copper plate 42 on the other principal surface as a heat radiating member. The copper plate 41 constituting the circuit member has higher hardness than that of the copper plate 42 constituting the heat radiating member in this heat radiating substrate 1. As the rigidity on the circuit member side becomes higher as compared with the heat radiating member side, the direction of warpage occurring on the heat radiating substrate can be controlled in such a manner that it protrudes toward the heat radiating member side. Thereby, the adhesion between the heat radiating member and a heat sink can be increased and the heat radiating property of the heat radiating substrate can be improved as well. COPYRIGHT: (C)2011,JPO&INPIT |
