METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD WITH THICK TRACES

摘要

A method for manufacturing printed circuit board includes steps below. A first electrically conductive layer including a first surface and a second surface at an opposite side thereof to the first surface is provided. A number of first traces directly formed on the second surface. A first insulating layer is formed on the second surface of the first electrically conductive layer and the surface of the first traces. The electrically conductive layer is etched to form a number of second traces, the second traces superpose the first traces, the first traces and the second traces constitute a circuit pattern.