发明名称 |
COMPOSITE STAMP FOR EMBOSSING |
摘要 |
A method of manufacturing a composite stamp (24) for embossing comprises the steps of: (a) taking a master structure (10) having a conductive surface (16) and dielectric features (18) thereon; (b) depositing an opaque material on exposed regions of the conductive surface (16) to form an opaque mask (20); (c) coating the dielectric features (18) and opaque mask (20) with a fluid material (4) which is capable of being transformed to a form-retaining material; (d) causing or permitting the fluid material (4) to be transformed to a form-retaining material which is bonded to the opaque mask (20); and (e) removing the form-retaining material (4) and bonded opaque mask (20) from the master structure (10) to provide the composite stamp (24). Other aspect of the invention provide a composite stamp (24) and a composite structure (22) for making the composite stamp. |
申请公布号 |
US2011217409(A1) |
申请公布日期 |
2011.09.08 |
申请号 |
US200813125716 |
申请日期 |
2008.10.28 |
申请人 |
|
发明人 |
RUDIN JOHN CHRISTOPHER;KITSON STEPHEN;TAPHOUSE TIMOTHY;PEARSON DAVID ALEXANDER |
分类号 |
B29C59/02;B32B37/12;C25D1/10 |
主分类号 |
B29C59/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|