| 摘要 |
Method for preparation of a TEM-plate for inspection in a transmission electron microscope. The plate is taken from a structured sample, especially a microelectronic component, wherein the exact sample location is unknown. Accordingly the sample area is pre-located and the sample is then cut, e.g. using a FIB instrument, with the sample cut so thick, e.g. 500 nm, that the whole pre-located structural element is contained within the plate. |
