发明名称 Motion sensor, and method of manufacturing motion sensor
摘要 <p>A sensor device 1 includes: a silicon substrate 10; a first electrode 11 provided at an active surface 10a side of the silicon substrate 10; an external connection terminal 12 provided at the active surface 10a side so as to be electrically connected to the first electrode 11; a stress relief layer 15 provided between the silicon substrate 10 and the external connection terminal 12; and a vibrating gyro element 20 as a sensor element including a extraction electrode 29. The vibrating gyro element 20 is held to the silicon substrate 10 by connection between the extraction electrode 29 and the external connection terminal 12.</p>
申请公布号 EP2363689(A2) 申请公布日期 2011.09.07
申请号 EP20110156418 申请日期 2011.03.01
申请人 SEIKO EPSON CORPORATION 发明人 OTSUKI, TETSUYA
分类号 G01C19/5628;G01C19/56 主分类号 G01C19/5628
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