| 摘要 |
PROBLEM TO BE SOLVED: To provide an efficient method of manufacturing a multilayer printed wiring board with high outline precision without damaging an outline. SOLUTION: The outline of a region which serves as a non-bonding part S of respective printed wiring mother boards 10A, 20A, 30A and 40A is extracted before the printed wiring mother boards 10A, 20A, 30A and 40A are laminated and bonded. An outline of a bonding part M with rigidity is extracted after lamination. COPYRIGHT: (C)2007,JPO&INPIT |
