发明名称 Semiconductor device with a gel-filled case
摘要 When a silicone gel is injected into a case, since the gel is liquid before curing, the gel attempts to rise along a minute gap formed between a front face of a first electrode and a rear face of a resin member due to capillary action. However, since the gap becomes larger at a cavity in the first electrode, the rising motion of the gel stops at the level of the cavity. More specifically, the gel is prevented from reaching portions of the first electrode and a second electrode for connection with external terminals. Further, since the rising motion of the gel can be prevented by the cavity, the first electrode and the second electrode can be arranged in a close relationship with each other.
申请公布号 EP1533839(A3) 申请公布日期 2011.09.07
申请号 EP20040024415 申请日期 2004.10.13
申请人 KABUSHIKI KAISHA TOYOTA JIDOSHOKKI 发明人 AKAGAWA, KOICHI;NAGASE, TOSHIAKI;ONISHI, HIROYUKI;ISHIKAWA, JUN
分类号 H01L23/24;H01L25/00;H01L23/12;H01L23/495 主分类号 H01L23/24
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