TWO-LAYER FLEXIBLE COPPER-CLAD LAMINATE SUBSTRATE AND PROCESS FOR PRODUCING SAME

摘要

A process for producing a two-layer flexible copper-clad laminate substrate by wet plating using an acidic copper plating bath composition and a resin film coated with a conductive metal serving as a seed layer.  The process for two-layer FCCL production includes: a step in which a seed layer is formed by electroless nickel plating on a hydrophilized surface of a resin film; and a step in which this resin film is subjected, without performing primary copper plating, to wet electroplating in the acidic copper plating bath composition to thickly deposit a conductive copper layer on the seed layer.