| 发明名称 |
Method for fabricating clamping device for flexible substrate |
| 摘要 |
A method of fabricating a clamping device for a flexible substrate is provided. A carrier board is provided. A plurality of holes is formed in the carrier board. A fixed positioning assembly and a movable positioning assembly are respectively embedded in the plurality of holes.
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| 申请公布号 |
US8011085(B2) |
申请公布日期 |
2011.09.06 |
| 申请号 |
US20090542123 |
申请日期 |
2009.08.17 |
| 申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
WU CHIN-JYI;TSAI CHEN-DER;TU YUN-CHUAN;WONG TE-CHI |
| 分类号 |
B23P19/00;B23Q1/00 |
主分类号 |
B23P19/00 |
| 代理机构 |
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代理人 |
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