| 发明名称 |
STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS |
| 摘要 |
<p>Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes.</p> |
| 申请公布号 |
CA2828468(A1) |
申请公布日期 |
2011.09.01 |
| 申请号 |
CA20112828468 |
申请日期 |
2011.02.25 |
| 申请人 |
INNOVA DYNAMICS, INC. |
发明人 |
MITTAL, ALEXANDER CHOW;SRINIVAS, ARJUN DANIEL;ROBINSON, MATTHEW R.;YOUNG, MICHAEL EUGENE |
| 分类号 |
H01B5/14 |
主分类号 |
H01B5/14 |
| 代理机构 |
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