| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board whose warpage is reduced while maintaining rigidity thereof. SOLUTION: The printed wiring board 10 includes an insulating base 11, a first region 21 which is formed on the base and in which a conductor-made wiring portion 41 functioning as a product of the printed wiring board is formed, and a second region 22 which is formed on the base and in which a conductor-made dummy portion 52 not functioning as the product is formed, wherein the ratio (B/A)×100 (%) of a conductor remaining rate A of the first region 21 to a conductor remaining rate B of the second region 22 is 105 to 300%. COPYRIGHT: (C)2011,JPO&INPIT
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