发明名称 |
LIQUID FOR PROTECTING COPPER WIRING SURFACE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CIRCUIT ELEMENT |
摘要 |
A copper wiring material surface protective liquid is provided that is used in production of a semiconductor circuit device containing copper wiring, and consists of an aqueous solvent and an acetylene alcohol compound containing at least 3-phenyl-2-propyn-1-ol. A method for producing a semiconductor circuit device is provided that contains: forming an insulating film and/or a diffusion preventing film on a silicon substrate; then forming a copper film by a sputtering; then forming a copper film or a copper alloy film containing 80% by mass or more of copper thereon by a plating method; and flattening the film by a chemical mechanical polishing (CMP) method, thereby providing a semiconductor substrate containing a flattened copper wiring, in which the semiconductor substrate having an exposed surface of a copper wiring material is treated by making in contact with the copper wiring material surface protective liquid.
|
申请公布号 |
US2011212617(A1) |
申请公布日期 |
2011.09.01 |
申请号 |
US200913062365 |
申请日期 |
2009.09.02 |
申请人 |
MITSUBISHI GAS CHEMICAL COMPANY, INC. |
发明人 |
YAMADA KENJI;SHIMADA KENJI;MATSUNAGA HIROSHI |
分类号 |
H01L21/28;C09D7/00 |
主分类号 |
H01L21/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|