发明名称 ATOMIC LAYER DEPOSITION EQUIPMENT AND METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide atomic layer deposition equipment which generates plasma stably. <P>SOLUTION: The atomic layer deposition equipment which forms a thin film on a substrate, is equipped with: a material gas supply which supplies material gas, i.e. the material of a thin film; an oxidation gas supply which supplies oxidation gas that reacts on the material gas to form a thin film; a plasma generator which generates plasma of oxidation gas; and an exhauster which exhausts the material gas and oxidation gas. The oxidation gas supply is equipped with: an oxygen gas reservoir which stores oxygen gas; and an ozone generator which generates ozone from oxygen gas stored in the oxygen gas reservoir. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011171361(A) 申请公布日期 2011.09.01
申请号 JP20100031334 申请日期 2010.02.16
申请人 MITSUI ENG & SHIPBUILD CO LTD 发明人 HATTORI NOZOMI
分类号 H01L21/31;C23C16/44;H01L21/336;H01L21/8242;H01L27/108;H01L29/786;H05H1/46 主分类号 H01L21/31
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