| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a stacked memory system that controls refresh operation of a memory using a logic, is designed to change the refresh frequency of each memory on the basis of temperature information of the memory and simplify wiring for inputting/outputting the temperature information between the memories and the logic. <P>SOLUTION: In the memory 200, an input selection temperature information Dtemp-3 and a self temperature information Dtemp-0 of a temperature sensor 220 are compared, and the higher one is output as an output selection temperature information Dtemp-1. Micro bumps 500a, 500b for the output selection temperature information Dtemp-1 and the input selection temperature information Dtemp-3 are arranged in the same position on the upper side surfaces and lower side surfaces of memory chips, respectively. TSV400b for integrated temperature is formed at the same position for each memory 200, signal paths corresponding to the integrated temperature information Dtemp-2 are shared. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
