发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base integrated circuit on the base substrate; attaching a base barrier on the base substrate adjacent a base perimeter thereof; mounting a stack substrate over the base substrate, the stack substrate having a stack substrate aperture with the stack substrate having an inter-substrate connector thereon; and dispensing a connector underfill through the stack substrate aperture encapsulating the inter-substrate connector, overflow of the connector underfill prevented by the base barrier.
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申请公布号 |
US2011210436(A1) |
申请公布日期 |
2011.09.01 |
申请号 |
US20100714431 |
申请日期 |
2010.02.26 |
申请人 |
CHOW SENG GUAN;GOH HIN HWA;HUANG RUI;KUAN HEAP HOE |
发明人 |
CHOW SENG GUAN;GOH HIN HWA;HUANG RUI;KUAN HEAP HOE |
分类号 |
H01L25/065;H01L21/60 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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