<p>The present invention relates to a compression molding device and method for electronic parts such as a substrate with chips mounted thereon. More particularly, the invention relates to a compression molding device and method thereof, which allow for separate control of molding pressure and clamping pressure on an individual substrate in the process of simultaneously performing compression molding on multiple substrates.</p>
申请公布号
WO2011105639(A1)
申请公布日期
2011.09.01
申请号
WO2010KR01188
申请日期
2010.02.25
申请人
HANMI SEMICONDUCTOR CO., LTD;KIM, BYOUNG SUK;OH, SOO HWAN