发明名称 |
FACE-TO-FACE (F2F) HYBRID STRUCTURE FOR AN INTEGRATED CIRCUIT |
摘要 |
An integrated circuit (IC) product includes a redistribution layer (RDL) having at least one conductive layer configured to distribute electrical information from one location to another location in the IC. The RDL also includes a plurality of wire bond pads and a plurality of solder pads. The plurality of solder pads each includes a solder wettable material that is in direct electrical communication with the RDL. |
申请公布号 |
KR20110098837(A) |
申请公布日期 |
2011.09.01 |
申请号 |
KR20117016910 |
申请日期 |
2009.12.18 |
申请人 |
ATI TECHNOLOGIES ULC |
发明人 |
MARTINEZ LIANE;TOPACIO RODEN R.;LOW YIP SENG |
分类号 |
H01L23/48;H01L21/60 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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