| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device which is mounted flatly and efficiently while keeping connection reliability between a plurality of chips and metallic wiring that electrically connects them. <P>SOLUTION: The electronic device 100 includes first chips 10 having electrode pads 11 as a plurality of the first electrode pads arranged along at least one side and second chips 20 that are laminated on the first chips 10 and having electrode pads 21 as a plurality of second electrode pads arranged along one side section where the first chips 10 and the second chips 20 are off-positioned in the X direction that meets the Y direction at least along one side section so as to allow the electrode pads 11 to be exposed and are laminated, and have insulative underlying sections 60 provided along the electrode pads 11 and the electrode pads 21 and metallic wiring 70 at least a part of which is laid on the underlying section 60 and that is connected to the electrode pads 11 and electrode pads 21. <P>COPYRIGHT: (C)2011,JPO&INPIT |
