| 摘要 |
<P>PROBLEM TO BE SOLVED: To further improve the reliability of a power module. <P>SOLUTION: In the power module in which active elements 13, 14 soldered to an electrode 8 on one surface of a ceramic substrate 7 are sealed with a resin 2, a conductor film 11 is formed on the other surface of the ceramic substrate 7, and the resin 2 comes up to the periphery of the conductor film 11. <P>COPYRIGHT: (C)2011,JPO&INPIT |
