发明名称 DIE COOLING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To perform uniform cooling in the periphery of a die cooling hole. SOLUTION: The die cooling structure 1 includes: an inner cylinder 4 that is arranged in a cooling hole 3 formed in a die 2; a plurality of heat transfer grains (metallic balls 8) that are evenly arranged in the entire gap 6 formed between the outer surface of the tip end 41 of the inner cylinder 4 and the inner surface of the cooling hole 3 and that are in contact with both the surfaces; and a joint member 5 that is connected to the inner cylinder 4 and that supplies a coolant into the inner cylinder 4. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011167751(A) 申请公布日期 2011.09.01
申请号 JP20100036204 申请日期 2010.02.22
申请人 JATCO LTD 发明人 SUGIMOTO MASAMICHI
分类号 B22C9/06;B22D17/22 主分类号 B22C9/06
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