摘要 |
PROBLEM TO BE SOLVED: To perform uniform cooling in the periphery of a die cooling hole. SOLUTION: The die cooling structure 1 includes: an inner cylinder 4 that is arranged in a cooling hole 3 formed in a die 2; a plurality of heat transfer grains (metallic balls 8) that are evenly arranged in the entire gap 6 formed between the outer surface of the tip end 41 of the inner cylinder 4 and the inner surface of the cooling hole 3 and that are in contact with both the surfaces; and a joint member 5 that is connected to the inner cylinder 4 and that supplies a coolant into the inner cylinder 4. COPYRIGHT: (C)2011,JPO&INPIT |