| 摘要 |
PROBLEM TO BE SOLVED: To prevent a component from floating owing to expansion of moisture absorbed into a substrate in a process where a component mounted on a double-sided flexible printed board is subjected to reflow soldering. SOLUTION: The double-sided flexible printed board 10 where a reinforcing plate 1 is arranged on the side opposite to the component mounting surface has a base film 5, a copper pattern 4a bonded to the component mounting surface side of the base film 5, and a copper pattern 4b bonded to the reinforcing plate side of the base film 5. Cover films 3a and 3b are bonded, respectively, to the copper patterns 4a and 4b, and the reinforcing plate 1 is bonded to the cover film 3b. Floating of a component is prevented by letting moisture in the substrate escape from ventilation holes 8 and 9 formed, respectively, in the reinforcing plate 1 and the copper pattern 4b on the reinforcing plate side. COPYRIGHT: (C)2011,JPO&INPIT
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