| 摘要 |
PROBLEM TO BE SOLVED: To provide a through-hole plating method by which only an inner surface of a through-hole can easily and quickly be subjected to plating inexpensively, and to provide a substrate produced by using the same. SOLUTION: A substrate intermediate 4 which has through-holes 7 penetrating an insulating layer 6 and two conductive masks 5 having openings in positions corresponding to the through-holes 7 are used. Entire regions of both front and rear surfaces of the substrate intermediate 4 are covered with the respective conductive masks 5 while fitting the position of the opening to the through-hole 7. A body 2 to be plated is formed by bringing the respective conductive masks 5 into close contact with at least a part of both front and rear surfaces of the substrate intermediate 4. The body 2 to be plated is immersed in a plating liquid 3, the entire surface of the body 2 to be plated including the inner surface of the through-hole 7 is plated by adhering metal thereto, and then the conductive masks 5 are removed from the substrate intermediate 4. COPYRIGHT: (C)2011,JPO&INPIT |
