发明名称 Packaging Materials With Enhanced Thermal-Insulating Performance
摘要 A packaging material including a paper-based substrate having a first surface and a second surface and a thermal-insulating composition on the first surface of the substrate, wherein the thermal-insulating composition includes, based on the total weight of the composition, filler in an amount of 20% to 70% by weight, organic binder in an amount of 15% to 70% by weight, and plasticizer in an amount of 0.5% to 10% by weight.
申请公布号 US2011210164(A1) 申请公布日期 2011.09.01
申请号 US201113080064 申请日期 2011.04.05
申请人 发明人 BABINSKY VLADISLAV;ARENANDER SVEN SAMUEL;NEWMAN DOBRIDGE CELESTE;BABCOCK BRUCE W.;HAWES DAVID H.
分类号 B65D3/06;B05D3/02;B32B3/00;B32B3/26;B32B5/16;B32B7/02;B32B29/00;B65D3/22 主分类号 B65D3/06
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