SUBSTRATE TREATMENT DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate treatment device capable of reducing the frequency of maintenance and determining an appropriate time of maintenance. SOLUTION: The substrate treatment device 10 includes: an ion source 40 for generating ions; a target 36 receiving an ion beam 45 from the ion source 40; a wafer holder 18 housed in a first vacuum chamber 11 and holding a wafer 1 that receives sputtered particles 46 from the target 36; an adhesion preventing plate 51 suppressing adhesion of sputtered particles 46 to a second vacuum chamber 22; and an adhesion amount predicting unit 61 predicting an adhesion amount of the particles 46 stuck to the adhesion preventing plate 51. COPYRIGHT: (C)2011,JPO&INPIT