| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation sheet in which a microencapsulated imidazole compound is hardly broken even if a filler is packed in a high density. SOLUTION: The insulation sheet comprises a polymer (A) that has an aromatic skeleton and a weight-average molecular weight of≥10,000, at least one resin (B) of an epoxy resin (B1) having a weight-average molecular weight of <10,000 and an oxetane resin (B2), a curing agent (C) obtained by microencapsulating an amine-based compound, a first inorganic filler (D) having a thermal conductivity of≥10 W/m K and a new Mohs hardness of≥3.1 and at least one substance (E) of an organic resin filler (E1) and a second inorganic filler (E2) having a new Mohs hardness of≤3. The content of the first inorganic filler (D) is 20-60 vol.% and the content of the substance (E) is 1-40 vol.%. COPYRIGHT: (C)2011,JPO&INPIT
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