PROCESSING METHODS AND APPARATUS WITH TEMPERATURE DISTRIBUTION CONTROL
摘要
Wafer treatment process and apparatus is provided with a wafer carrier (80) arranged to hold wafers (124) and to inject a fill gas into gaps (130) between the wafers and the wafer carrier. The apparatus is arranged to vary the composition, flow rate, or both of the fill gas so as to counteract undesired patterns of temperature non-uniformity of the wafers.
申请公布号
WO2011106064(A1)
申请公布日期
2011.09.01
申请号
WO2010US60258
申请日期
2010.12.14
申请人
VEECO INSTRUMENTS INC.;GURARY, ALEX;BELOUSOV, MIKHAIL;BOGUSLAVSKIY, VADIM;MITROVIC, BOJAN
发明人
GURARY, ALEX;BELOUSOV, MIKHAIL;BOGUSLAVSKIY, VADIM;MITROVIC, BOJAN