WIRELESS COMMUNICATION MODULE AND ENCAPSULATION METHOD

摘要

A wireless communication module includes: a Printed Circuit Board (PCB) (1), functional components (21) set on a first side portion (2) of the PCB (1), and functional pin pads (31) and grounding heat dissipation pads (32) set on a second side portion (3) of the PCB (1), wherein the functional pin pads (31) and the grounding heat dissipation pads (32) are attached to corresponding pads of a main board through surface mounting technology, and fixed and welded by a surface welding method. Correspondingly, an encapsulation method is provided in the present invention. By setting the functional pin pads around the PCB bottom and setting the grounding heat dissipation pads on the central area of the PCB bottom, the wireless communication module and the encapsulation method in the present invention can effectively reduce the size of the module, ensure that Surface Mounting Technology (SMT) is more convenient, and have lower cost and better heat dissipation performance, and ensure that welding performance can be easily controlled.