PRESSURE SENSOR MODULE AND PRESSURE DETECTION DEVICE

摘要

Provided is a pressure detection device which uses a reduced number of parts to make the device low profile and which can be assembled with reduced man-hours. Also provided is a pressure sensor module which, in the temperature range from 60°C or below to minus 50°C or above, normally operates and has satisfactory accuracy. The pressure sensor module is provided with: a ceramic substrate in which a pressure introduction hole is formed and which has a thermal expansion coefficient of 10 × 10-6 or below; a semiconductor pressure sensor chip normally operating even at a temperature of minus 40°C or below and joined to the ceramic substrate, in which the pressure introduction hole is formed, by an adhesive agent having elasticity even at a temperature of minus 40°C or below; an electronic circuit mounted on the ceramic substrate and amplifying the output voltage of the semiconductor pressure sensor chip; a wiring pattern formed on the ceramic substrate using a material having electrical properties which change a little even at a temperature of minus 40°C or below; and a capacitor for removing noise, joined to the wiring pattern and operating normally even at a temperature of minus 40°C or below.