| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical device and the like in which attaching a bonding wire to a bonding pad is performed more reliably. <P>SOLUTION: The optical device comprises a substrate having a first surface 11A and a second surface 11B; a light-emitting element 14 having a first center 14-1, installed on the second surface 11B; and a light-receiving element 16 having a second center 16-1, installed on the first surface 11A. At least a part of the light-emitting element 14 is arranged at a position, overlapping the light-receiving element 16 with respect to a plan view; the light-receiving element 16, installed after the light-emitting element 14, has a bonding pad 16A', provided at a position displaced relative to the second center 16-1 towards a first direction DR1 with respect to the plan view; and the first center 14-1 is provided at a position displaced relative to the second center 16-1 towards a second direction DR2 with respect to the plan view. <P>COPYRIGHT: (C)2011,JPO&INPIT |
