发明名称 LEAD FRAME SHEET
摘要 A lead frame sheet made of an electrically conductive material has lead frames integrally formed on it. Spacing members also are formed from the sheet. A first one of the spacing members is proximal to a first longitudinal edge of the sheet and a second one of the spacing members is proximal to a second longitudinal edge of the sheet. The spacing members extend from an underside surface of the sheet and, in use, space the underside surface from a planar support such as a surface of a heating block.
申请公布号 US2011212341(A1) 申请公布日期 2011.09.01
申请号 US201113008914 申请日期 2011.01.19
申请人 FREESCALE SEMICONDUCTOR, INC. 发明人 LI TING;HE QINGCHUN;LIU YONGQIANG
分类号 H01L23/495 主分类号 H01L23/495
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