METHOD OF STACKING CHIPS

摘要

According to an embodiment of the present invention, a method of stacking chips is provided. The method includes: providing a first substrate, wherein, on or within a surface of the first substrate, a first contact structure is arranged, wherein the first contact structure includes an intermediate layer and at least one contact for contacting the first substrate, the intermediate layer being provided on the surface of the first substrate and having at least one recess, the at least one recess accommodating or allowing access to the at least one contact; providing a second substrate, wherein on a surface of the second substrate, a second contact structure is arranged, the second contact structure having at least one contact; and inserting the second contact structure into the at least one recess of the intermediate layer.