SUBSTRATE COOLING APPARATUS AND SUBSTRATE PROCESSING SYSTEM

摘要

A substrate cooling device configured to cool a substrate after a treatment, the device includes: a housing having a space configured to house a substrate internally; a pair of holder sections provided so as to face an inner wall of the housing, and including a groove section supporting an end neighborhood of the substrate; and a pair of cooling sections including a cooling mechanism provided to sandwich the pair of holder sections in a direction crossing a direction in which the holder sections face each other. According to the invention, a time for cooling the substrate after the treatment can be reduced.