| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder resist composition of high reflectance and high resolution while preventing a decrease in reflectance caused by discoloring deterioration, and a printed circuit board obtained by forming a solder resist using the solder resist composition. <P>SOLUTION: The solder resist composition contains (A) carboxyl group content resin not having an aromatic ring, (B) a bisacylphosphine oxide photopolymerization initiator, (C) a monoacylphosphine oxide photopolymerization initiator, (D) a photopolymerizable monomer, (E) rutile type titanium oxide, (F) an epoxy compound, (G) an organic solvent, and (H) an antioxidant. <P>COPYRIGHT: (C)2011,JPO&INPIT |
