| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve a longer lifetime of a tray by preventing displacement of a substrate caused by abrasion of the tray accompanying repetition of a plasma treatment, thereby reducing an operational cost of a plasma processing apparatus. <P>SOLUTION: In a tray body 41 of a tray 11, substrate receiving holes 42A-42F are provided so as to penetrate in the thickness direction. A substrate 12 is supported by a substrate supporting part 44 projecting from a hole wall 42a of each of the substrate receiving holes 42A-42F. A projection 45 projecting around each of the substrate receiving holes 42A-42F is provided on an upper surface 41a of the tray body 41. Even if abrasion in the upper surface 41a of the tray body 41 due to repetition of a dry etching treatment develops, a substrate 2 maintains a state where the substrate is received in the substrate receiving holes 42A-42F without causing displacement by being restrained by the projection 45. <P>COPYRIGHT: (C)2011,JPO&INPIT |
