METHOD OF MANUFACTURING MODULE

摘要

PROBLEM TO BE SOLVED: To provide a module having small variance in characteristics.

SOLUTION: The method is provide to manufacture a high-frequency module 21 having: a resin portion 25 mounted on a resin substrate 22 and having a semiconductor element 24 buried therein; and a shield metal film 26 covering a surface of the resin portion 25. The method includes: a softening step 71 of placing the resin substrate 22 over a resin tank 63 with the semiconductor element 24 down and softening a resin 25a fed into the resin tank 63 until the resin 25a becomes fluidized; a dipping step 72 of bringing a lower surface of the resin substrate 22 into contact with a liquid surface of the resin 25a thereafter; a compression inflow step 73 of forcing the resin 25a to flow in the gap between the resin substrate 22 and semiconductor element 24 thereafter; a curing step 74 of curing the resin 25a; and a step of forming the shield metal film 26 thereafter. Residual stress in the resin portion 25 is then reduced to make deformation small.

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