发明名称 |
LIGHT EMITTING DIODE PACKAGES, LIGHT EMITTING DIODE SYSTEMS AND METHODS OF MANUFACTURING THE SAME |
摘要 |
In a method of forming an LED semiconductor device, and in an LED semiconductor device, an LED is provided on a substrate. A first encapsulant material layer is provided on the LED, and the first encapsulant material layer is firstly annealed. A luminescence conversion material layer is provided on the firstly annealed first encapsulant material layer, and the first encapsulant material layer and the luminescence conversion material layer and secondly annealed.
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申请公布号 |
US2011210367(A1) |
申请公布日期 |
2011.09.01 |
申请号 |
US201113106304 |
申请日期 |
2011.05.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM YUSIK |
分类号 |
H01L33/50;H01L33/54;H01L33/56;H01L33/60;H01L33/62 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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