| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a light emitting diode unit, in a short period of time, while suppressing deterioration and breakage of members such as an LED chip, a phosphor, and a package substrate. <P>SOLUTION: On the package substrate on which LED chips are mounted, a precursor solution containing phosphors and organic metal compounds is supplied and heated. Then, a first vitreous body with phosphors distributed is formed, which seals the light emitting surface of the LED chip (a first vitreous body forming process). After that, a second vitreous body is formed on the first vitreous body by solidifying molten glass drop (a second vitreous body forming process). <P>COPYRIGHT: (C)2011,JPO&INPIT |
