| 摘要 |
PROBLEM TO BE SOLVED: To prevent cutting dusts and the like from adhering to an adhesive layer at the time of dividing a wafer in a state wherein the adhesive layer is adhered on the surface of a wafer. SOLUTION: A method for manufacturing an electronic component provided with an adhesive film includes: an adhering step wherein the adhesive film, which is formed by laminating a base material and the adhesive layer, is adhered on the surface of the wafer having electronic components formed thereon; an image pickup step wherein an image of the surface of the wafer is picked up by receiving light that has been reflected on the surface of the wafer and passed through the base material and the adhesive layer; a dividing position determining step wherein the positions where the wafer is to be divided are determined on the basis of the image; and a dividing step wherein the electronic components are individualized by dividing the wafer. COPYRIGHT: (C)2011,JPO&INPIT |
