| 摘要 |
PROBLEM TO BE SOLVED: To easily form conductive sections such as bump, wiring, etc. SOLUTION: The method of manufacturing electronic components includes a step for forming photoresists 20 and 22 on a substrate 10, a step for forming at a part of the photoresists 20 and 22 an opening 24 whose opening width on the lower part of an opening is larger than that on the upper part of the opening, a step for forming a film over a conductive section 26 on the exposed surface of the substrate 10 when viewed from the photoresist 22, and a step for removing the photoresists 20 and 22 and the conductive section 26 on the photoresist 22 respectively and leaving the conductive section 26 within the opening 24. COPYRIGHT: (C)2011,JPO&INPIT
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