发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which extends the lifespan of a heater that heats a flange, in the flange connecting gas pipes to each other, and enables efficient heating of the flange. SOLUTION: The substrate processing apparatus has gas pipes including a reaction pipe which houses and processes a substrate, a gas supply pipe which supplies a process gas into the reaction pipe, and a gas exhaust pipe which exhausts the reaction pipe of an atmospheric gas. The gas pipes are connected to each other with a clamper 3 via flanges 44a and 46a formed on ends of the gas pipes. Straight pipe portions 44 and 46 continuous with the flanges 44a and 46a are provided with a heater 94, and the flanges 44a and 46a are also provided with heaters 93 and 95. A heat insulator 92 is provided to cover the flanges 44a and 46a and the straight pipe portions 44 and 46. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011171509(A) 申请公布日期 2011.09.01
申请号 JP20100033794 申请日期 2010.02.18
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 YOSHINO AKIO
分类号 H01L21/205;H01L21/31 主分类号 H01L21/205
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